Intel Unveils Industry-Major Glass Substrates to Fulfill Demand from customers for Extra Powerful Compute :: Intel Company (INTC)
Doris Ratliff
5 min read

An Intel engineer retains a test glass main substrate panel at Intel’s Assembly and Examination Technologies Development factories in Chandler, Arizona, in July 2023. Intel’s superior packaging systems occur to lifetime at the company’s Assembly and Take a look at Technology Growth factories. (Credit history: Intel Corporation)
A photograph shows glass substrate exam units at Intel’s Assembly and Test Engineering Improvement factories in Chandler, Arizona, in July 2023. Intel’s superior packaging systems occur to life at the company’s Assembly and Check Technological innovation Development factories. (Credit rating: Intel Corporation)
Hamid Azimi, company vice president and director of substrate technological innovation growth at Intel Corporation, retains an Intel assembled glass substrate check chip at Intel’s Assembly and Examination Technology Enhancement factories in Chandler, Arizona, in July 2023. Intel’s state-of-the-art packaging technologies appear to lifetime at the company’s Assembly and Check Technologies Advancement factories. (Credit: Intel Corporation)





Glass substrates assist prevail over limits of organic and natural components by enabling an get of magnitude enhancement in layout guidelines needed for foreseeable future details centers and AI products.
SANTA CLARA, Calif.–(Company WIRE)–
What is New: Intel nowadays declared one of the industry’s initially glass substrates for upcoming-technology superior packaging, prepared for the latter aspect of this ten years. This breakthrough accomplishment will permit the ongoing scaling of transistors in a deal and progress Moore’s Legislation to supply details-centric programs.
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Hamid Azimi, company vice president and director of substrate engineering improvement at Intel Company, holds an Intel assembled glass substrate check chip at Intel’s Assembly and Take a look at Technological innovation Improvement factories in Chandler, Arizona, in July 2023. Intel’s highly developed packaging systems occur to lifestyle at the company’s Assembly and Exam Technological know-how Progress factories. (Credit score: Intel Company)
“After a decade of analysis, Intel has realized field-main glass substrates for advanced packaging. We seem ahead to delivering these chopping-edge technologies that will benefit our important gamers and foundry shoppers for decades to occur.”
–Babak Sabi, Intel senior vice president and standard manager of Assembly and Exam Improvement
Why It Matters: In contrast to today’s organic and natural substrates, glass provides unique homes this sort of as ultra-reduced flatness and better thermal and mechanical stability, ensuing in much larger interconnect density in a substrate. These advantages will allow for chip architects to generate superior-density, significant-overall performance chip offers for info-intense workloads these as artificial intelligence (AI). Intel is on keep track of to deliver comprehensive glass substrate methods to the marketplace in the next 50 percent of this 10 years, letting the sector to carry on advancing Moore’s Law past 2030.
By the stop of the decade, the semiconductor marketplace will likely arrive at its boundaries on currently being ready to scale transistors on a silicon offer applying organic products, which use additional electrical power and include restrictions like shrinkage and warping. Scaling is very important to the progress and evolution of the semiconductor market, and glass substrates are a viable and essential up coming stage for the subsequent technology of semiconductors.
How It Operates: As the demand for more powerful computing improves and the semiconductor marketplace moves into the heterogeneous period that uses multiple “chiplets” in a package deal, improvements in signaling speed, ability shipping and delivery, structure rules and steadiness of deal substrates will be crucial. Glass substrates possess top-quality mechanical, actual physical and optical attributes that enable for a lot more transistors to be linked in a package deal, furnishing greater scaling and enabling assembly of larger chiplet complexes (identified as “system-in-package”) in comparison to natural and organic substrates in use currently. Chip architects will have the ability to pack much more tiles – also known as chiplets – in a smaller sized footprint on one particular bundle, though obtaining performance and density gains with increased versatility and reduce overall price tag and electric power utilization.
About the Use Situations: Glass substrates will originally be launched into the marketplace the place they can be leveraged the most: purposes and workloads requiring more substantial kind element deals (i.e., details facilities, AI, graphics) and better velocity abilities.
Glass substrates can tolerate increased temperatures, offer 50% a lot less sample distortion, and have extremely-very low flatness for enhanced depth of focus for lithography, and have the dimensional security essential for incredibly restricted layer-to-layer interconnect overlay. As a end result of these unique qualities, a 10x improve in interconnect density is achievable on glass substrates. Even further, improved mechanical attributes of glass enable extremely-large form-aspect offers with pretty superior assembly yields.
Glass substrates’ tolerance to better temperatures also presents chip architects flexibility on how to set the design and style rules for energy delivery and signal routing due to the fact it gives them the capability to seamlessly combine optical interconnects, as very well as embed inductors and capacitors into the glass at greater temperature processing. This makes it possible for for superior energy supply answers when achieving large-velocity signaling that is desired at substantially lessen electricity. These quite a few gains convey the industry nearer to becoming ready to scale 1 trillion transistors on a bundle by 2030.
How We Do It: Intel has been researching and assessing the reliability of glass substrates as a alternative for organic and natural substrates for more than a 10 years. The business has a extended background of enabling up coming-generation packaging, possessing led the field in the changeover from ceramic package to natural deal in the 1990s, being the initially to help halogen and guide-absolutely free offers, and remaining the inventor of sophisticated embedded die packaging systems, the industry’s initially active 3D stacking systems. As a final result, Intel has been capable to unlock an total ecosystem about these systems from equipment, chemical and resources suppliers to substrate producers.
What’s Upcoming: Making on the momentum of modern PowerVia and RibbonFET breakthroughs, these industry-major glass substrates for innovative packaging show Intel’s ahead concentration and eyesight for the upcoming era of compute beyond the Intel 18A method node. Intel is on the path to providing 1 trillion transistors on a package deal by 2030 and its ongoing innovation in highly developed packaging such as glass substrates will aid accomplish this aim.
A lot more Context: Glass Substrates Explained in 60 Seconds (Video clip) | Intel Prospects the Way with Sophisticated Packaging (Information) | State-of-the-art Packaging with Glass Substrates (Movie B-Roll)
About Intel
Intel (Nasdaq: INTC) is an marketplace chief, producing earth-altering technological know-how that permits worldwide progress and enriches lives. Inspired by Moore’s Law, we consistently work to advance the design and style and manufacturing of semiconductors to assist address our customers’ best troubles. By embedding intelligence in the cloud, network, edge and just about every variety of computing gadget, we unleash the potential of details to completely transform business enterprise and culture for the greater. To discover a lot more about Intel’s improvements, go to newsroom.intel.com and intel.com.
© Intel Company. Intel, the Intel logo and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and manufacturers may be claimed as the residence of other folks.
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Robin Holt
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Supply: Intel
Released Sep 18, 2023 • 9:00 AM EDT

